Cadence Integrity 3D-IC | Platform for Multi-Die System Design, Analysis & Implementation

Cadence Integrity 3D-IC is a comprehensive platform for the design, analysis, and implementation of complex 2.5D and 3D integrated circuit systems. It provides a unified environment to plan, integrate, and optimize multi-die systems, including chiplets, interposers, and advanced packaging technologies.

Core Functionality Overview:

• System-Level Planning & Architectural Exploration: Allows for early floorplanning, partitioning, and thermal/power/performance trade-off analysis for multi-die systems before detailed implementation.

• Integrated Physical Design & Analysis: Manages the co-design of dies, interposers, and packages, integrating placement, routing, and 3D-aware analysis for signal integrity, power integrity, and thermal management.

• Chiplet & Advanced Packaging Integration: Supports heterogeneous integration of chiplets from different process nodes, with tools for managing bump/TSV placement, micro-bump routing, and system-level DRC/LVS.