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- Search:Cadence Quantus QRC 2025 crack Cadence Quantus QRC 2025 download
Description
Achieve Signoff Confidence with Cadence Quantus QRC 2025
Cadence Quantus QRC 2025 is a high-performance, signoff-accurate parasitic extraction solution integral to the modern integrated circuit (IC) design flow. As semiconductor features shrink to angstrom-scale dimensions, the parasitic resistance (R), capacitance (C), and inductance (L) of interconnect wires become dominant factors affecting chip performance, power, and reliability. Quantus QRC extracts these critical parasitic elements from the physical layout of a chip, providing the accurate netlist data required by signoff timing and power analysis tools (like Tempus and Voltus) to predict real-world silicon behavior before manufacturing.
Core Functional Capabilities of Quantus QRC 2025
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Signoff-Accurate RC and RCL Extraction
Extract parasitic resistances and capacitances with the precision required for final design signoff. For high-frequency analog, RF, and advanced digital designs, it also performs 3D field-solving for inductance (L) extraction, capturing skin and proximity effects essential for signal integrity analysis. -
Massively Scalable Distributed Processing
Handle the enormous data volumes of modern SoCs and large custom blocks. The software employs distributed processing across multiple CPUs and machines, enabling fast turnaround times for full-chip extraction, which is critical for meeting tight project schedules. -
Advanced-Node Technology Support
Model the complex 3D interconnect structures of the latest process nodes. Quantus QRC is certified by leading foundries for nodes from 5nm and below, accurately accounting for multi-patterning, FinFET geometries, and complex dielectric stacks. -
Tight Integration with the Cadence Flow
Operate seamlessly within the Cadence ecosystem. It integrates directly with the Virtuoso platform for custom/analog design and the Innovus and Genus implementation systems for digital flows, enabling "in-design" extraction for rapid feedback during layout and a smooth handoff to final signoff.