The Cadence® rF SiP Methodology Kit accelerates the application of eDA technologies to system-in-package (SiP) designs for radio Frequency (rF) and wireless applications. it provides methodologies that maximize design productivity and predictability for customers leveraging the advantages of SiP technology. An integrated set of products built around proven methodologies enables complete front-to-back SiP design and implementation. All this is demonstrated on a segment representative design, resulting in reduced time to new products, increased functional densities, and higher system performance. CADENCE SIP DESIGN TECHNOLOGY CADENCE RF SIP METHODOLOGY KIT Manufacturers of high-performance consumer electronics are The Cadence rF SiP Methodology Kit leverages new SiP turning to SiP design because it can provide a number of technologies and verified advanced methodologies for rF SiP advantages over just SoC. in addition to reduced cost, lower design. it enables wireless design teams to achieve predictable power, and higher performance, SiP design offers the flexibility design schedules by boosting design productivity while also to mix radio rF and high-speed digital circuitry in the same increasing the likelihood of first-pass success by improving package. However, this also means it requires expert engineering quality. By combining comprehensive links between system talent in widely divergent fields. Conventional eDA solutions design, physical implementation and manufacturing, the kit have failed to automate the design processes required for allows full-SiP electrical analysis and characterization of critical efficient SiP development. By enabling and integrating design paths as well as behavioral modeling from overall system-level concept exploration, capture, construction, optimization, and simulation through bottom-up verification. validation of complex multi-chip and discrete substrate These capabilities are demonstrated on a segment representative assemblies on printed circuit boards (PCBs), the Cadence SiP design (an 802.11b/g wLAN rF SiP) that includes a Helic-based design technology streamlines the integration of multiple high- rF transceiver and analog baseband die in a 180nm generic pin-count chips onto a single substrate. This approach allows CMOS process, a second AMS analog front-end baseband companies to adopt what were once expert engineering SiP interface die in a 90nm generic CMOS process, and embedded design capabilities for mainstream product development. and discrete passive off-chip components in a generic LTCC Cadence SiP solutions seamlessly integrate into Cadence substrate. The kit also contains re-usable, pre-configured encounter® for die abstract codesign, Cadence virtuoso® for components from test-benches, models, and simulation plans for rF module design, and Cadence Allegro® for package/board block and full SiP-level verification and physical implementation approaches. Additionally, design teams are led through a step- by-step example on how to apply advanced Cadence technologies to best achieve design success.