C-Mold 2000.1

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  • Size:41MB
  • Language:english
  • Platform:Winxp/Win7
  • Freshtime:2006-11-26
  • Tag:C-Mold


C-MOLD Fusion eliminates the time consuming task of creating a midplane model in order to do analysis. C-MOLD Fusion works directly on a CAD model and allows users to simulate both the filling and packing stages of the injection molding process. The technology functions similarly to Moldflow’s flagship Plastics Insight product, and has now been extended to the recently acquired C-MOLD product. In addition, C-MOLD 2000.7 includes an underfill encapsulation module to simulate the increasingly popular thermosetting flip-chip encapsulation process. Flip-chip, a relatively new technology for microchip packaging, does not require wire or molding for the process. The chip is bonded directly on the pc-board or substrate -- creating a smaller and denser envelope that connects to the board. "The latest version of C-MOLD 2000 represents our commitment to the community of advanced C-MOLD users. The breadth of new capabilities will help our customers save valuable time while adding quality to their products. In an age of slashing new product development cycles, C-MOLD 2000 software addresses the tough engineering tasks that have traditionally slowed time to market," says Ken Welch, Moldflow’s Vice-President of marketing. Thermoplastic injection molding, gas-assisted injection molding, injection-compression molding, and co-injection molding can be completely simulated from filling and packing to shrinkage and warpage using the C-MOLD 2000 interface. Thermoset, rubber injection molding, RIM, RTM/SRIM, as well as microchip and flip-chip encapsulation, are also supported in the C-MOLD 2000 environment. In addition, C-MOLD 2000’s web-based engineering reporting features an improved three-step Report Wizard that automatically prompts users for input required to generate a complete report within minutes. Users can easily share reports with all members of the design team. About Moldflow Corporation Moldflow is the world leader in plastic simulation software used by designers and manufacturers to produce optimal plastic parts. Customers such as BASF, Baxter, BMW, Compaq, Dow Chemical, DuPont, Ford, GE Plastics, Hewlett-Packard, Lego, Mazda, Monsanto, Nypro, Toshiba, Toyota, Samsung, Sun Microsystems, and many others use Moldflow technology to produce billions of injection molded parts each year. The automotive, aerospace, computer, consumer goods, and medical industries have incorporated Moldflow’s easy to use, predictive applications throughout all phases of the injection molded plastic part design to manufacture processes to reduce product costs, accelerate time-to-market and optimize plastic part production.


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