Ansoft TPA 7.0


ANSYS Turbo Package Analyzer (TPA) software provides the package extraction and automation capability needed to address the electrical requirements of today's complex high-performance SiP, chip-scale, flip-chip, ball-grid array and wirebond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with ANSYS Nexxim or alternative SPICE-compatible tools to perform subsequent transient analyses, such as crosstalk, overshoot and TDR. TPA further enables the prediction of IC package performance and compatibility, facilitating performance trade-off analysis before a design is committed to fabrication. TPA couples with leading electronic package layout tools to accurately model package interconnect elements, such as non-orthogonal traces, vias, wirebonds, and solder balls, and to take into account the non-ideal ground planes prevalent in these advanced IC package designs.


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