ANSYS IceChip

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  • Size:49MB
  • Language:english
  • Platform:Winxp/Win7
  • Freshtime:2008-05-05
  • Tag:ANSYS IceChip

Description

 

::::::English Description::::::

ANSYS Icechip brings powerful and easy-to-use thermal analysis to Cadence APD and Sigrity UPD (previously Synopsys Encore). Make thermal analysis a seamless part of the design process.

  • Simulate all common packaging types -- leaded, leadless, BGA, Multi-chip packages, stacked die, system-in-package and multi-chip packages including traces, vias and wire bonds

  • Easy and intuitive user interface brings thermal analysis to designers without the need for a specialized background in heat transfer.

  • Perform trade studies to optimize the thermal design

  • The direct ECAD interface imports every die (even stacked die), trace, via, solderballs, encapsulant and bond wires.

  • Import complex geometry like lead frames or heat spreaders from MCAD tools.

  • Define non uniform power at the die level to predict hot spots.

  • Export the model to ANSYS for stress analysis

  • Put the component on a standard JEDEC board and simulate JEDEC thermal tests.

  • Fast solve time, typically minute

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