Mentor Graphics HyperLynx 8.1

Description

HyperLynx® Signal Integrity enables engineers to quickly and accurately analyze and eliminate signal integrity and EMI/EMC design problems early in the design cycle. HyperLynx Signal Integrity comes ready to use in virtually any PCB design flow and offers unprecedented time-to-results, improving productivity, reducing development and product costs, and increasing product performance. Mentor Graphics Corporation (NASDAQ:MENT) today announced it was honored by the International Engineering Consortium (IEC) with the annual DesignVision award in the System Modeling and Simulation Tool category for its HyperLynx® PI (Power Integrity) product. This solution delivers fast-time-to-accurate-results in the analysis of AC and DC behavior for printed circuit board (PCB) power distribution networks. The IEC announced the winners of the DesignVision Award at DesignCon on February 2, 2010. The winning products were selected on the basis of innovative design, uniqueness, market impact, customer benefits and value to the industry. “This year’s DesignVision Awards received a record-breaking 105 submissions and we welcome industry professionals to learn more of this impressive design solution at DesignCon 2010.” “Our HyperLynx product suite, including power integrity analysis, enables us to provide the world’s number one technology and market-share-leading PCB systems design solution,” stated Henry Potts, vice president and general manager of Mentor’s Systems Design Division. “Many of our advanced users need to jigsaw as many as 30 power distribution networks into their complex, high-performance designs. Delivering clean and sufficient power in these networks, while balancing product costs and designer productivity, requires a very sophisticated analysis capability.” Power integrity analysis is an essential part of modern electronic design. Over the past few years, ICs (integrated circuits) have gone from single 5V power supplies to multiple voltages down to less than 1V. The ever-increasing number of voltages being used by ICs, in addition to dramatic increases in power consumption, makes proper power delivery an exceedingly difficult task.

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