Mentor Graphics has launched the latest version of its Xpedition PCB design process tool, Mentor Expedition Enterprise VX2.6, to address the growing complexity in modern advanced system design.

The increasing density of electronic products is driving companies to develop highly compact and feature-rich system designs at lower costs.

To effectively manage the demands for density and performance in advanced PCB systems, the new Xpedition process incorporates advanced technologies that enable the design and verification of 3D rigid-flex structures, as well as automated layout implementation for high-speed topologies with complex constraints.

Control the complexity of advanced rigid-flexible design Rigid and Rigid-Flex PCBs are now widely used in various electronic products, ranging from compact consumer electronics to highly reliability-and safety-critical systems in aviation, defense, and automotive electronics.

This Xpedition rigid-flex technology streamlines the entire design process, from initial layer stack-up to manufacturing.

Engineers can design complex rigid and flexible PCBs that fully support 3D environments (not just 3D views, but also 3D design and verification), implementing a "correct-by-construction" approach that ensures optimal reliability and product quality.

3D validation ensures correct bending positions and prevents PCB components from interfering with folding, allowing for early-stage reviews to avoid costly redesigns.

Users can export 3D solid models to MCAD for efficient collaborative design of bidirectional PCB enclosures.

Integration Mentor's leading HyperLynx® high-speed analysis technology optimizes signal and power integrity in complex rigid-flex laminate structures. The

Xpedition process delivers comprehensive information about flexibility and rigidity for manufacturing preparation, presented in the standard ODB++ data format.

This methodology ensures precise communication of the PCB's final design intent to manufacturers while eliminating data uncertainties.

The new Xpedition process is specifically designed as the optimal solution for both rigid and flexible-rigid designs, covering all stages from conceptualization to production output.

High efficiency rigidity-The main features and functions of flexible development include: By leveraging the unique geometry of each zone to define rigid-flexible laminates, design modifications become simpler than zoned laminates.

Standard flexible materials (such as laminated sheets, "embedded" or "bikini-style" coverings, reinforcements, and adhesives) can be applied to these laminates.

Fully supports flexible bending to control the position and method of PCB bending, including flexible layer component layout, flexible routing, planar shape filling, teardrop pads, and trace pads.

After defining the bend, the design can be displayed and validated in 3D to ensure no conflicts occur.

A powerful user interface allows intuitive and simple selection of controls to ensure proper management of the design.

Electrical rule check (ERC) uses a customizable local rule checker and a comprehensive post-design check to ensure one-time verification.

Signal and power integrity analysis under the influence of flexibility ensures accurate modeling of interconnections across different stacked regions.

Use of Design for Manufacturability (DFM) validation and New Product Introduction (NPI) tools to ensure smooth and efficient management of PCB from design to manufacturing.