InCAM Overview CAM for HDI and IC Packaging InCAM® is a comprehensive CAM system for HDI boards that performs fast, high-precision CAM tooling. Easy to use, InCAM offers improved CAM productivity and advanced data integrity and fault indication in a collaborative work environment. Fast, high-precision CAM tooling Improved data integrity and fault indication Collaborative and secure work environment Streamlined user interface, easy-to-use tools Dedicated DFM and analysis tools for HDI boards Dedicated cleanup and analysis tools for IC packaging boards 64-Bit technology, multi-core CPU CAM Fast, high-precision CAM tooling Achieve results fast with Check & Fix tools, background processing and system-wide automation. Run global repairs on any layer and undo or rerun selected repairs with new parameters while other tasks run in the background, using the computer’s multi-core CPU capabilities. Improved data integrity and fault indication Find out how InCAM can help you manage and protect job data: Respond to warnings using ASCII-to-graphic synchronization at Input and Output. Use InCAM’s libraries to standardize company practices and reduce errors. Avoid scrap using Netlist Compare to locate problems and errors. Use cleanup tools to optimize input data for analysis. Follow the CAM Guide to ensure tasks are performed in the right order Collaborative and secure work environment InCAM is the first and only CAM system to offer true collaborative processing. Use the Lock Steps/Layers feature to co-tool jobs without coming into conflict with other operators. The result: increased productivity with high data integrity. Streamlined user interface, easy-to-use tools InCAM’s uncluttered desktop provides the optimum work environment. With related features grouped together, the tools you need are always at hand. Features are designed for maximum ease-of-use with minimum training. Create a customized CAM Guide to guide your operators step by step through the process flow. Dedicated DFM and analysis tools for HDI boards Enhance the speed and efficiency of HDI board production using dedicated DFM and analysis tools. Dedicated cleanup and analysis tools for IC packaging boards Enhance the speed and efficiency of IC packaging board production with InCAM’s new range of dedicated DFM and analysis tools.