ANSYS Electronics Suite 2024 R2

Description

ANSYS Electronics Suite 2024 R2

ANSYS has announced the release of Ansys Electronics 2024 R1. This solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before.

What's New in Ansys Electronics Desktop 2024 R1
Ansys Electronics Desktop (AEDT) provides highly integrated electromagnetic simulators, circuit/system simulation, ECAD links, and compliance reporting. The single desktop allows users to insert and co-simulate among multiple design types.


Electronics Desktop
- New view navigation controls
- Open MPI support extended to all relevant products in AEDT
- CPython connection to AEDT through gRPC
- Shared web licensing support for Pro, Premium, and Enterprise
- Animation export to Ensight format
- Improved display precision for near-zero floating point values
- Dark and light themes (Beta, Windows only)
- Ansys Cloud Gateway job management from AEDT (Beta)
- Web client for batch solve monitoring and reporting (Beta)
3D Modeler
- Copy-paste of designs with encrypted components
- Discovery 3D Modeler live connection
- Granta material attribute import from CAD files
- Improvements to subregions
- Lightweight geometry import through Discovery
- Integrated Hoops translators (Beta)
HFSS
- Array metadata export
- Array mask automation through CSV import
- SBR+ Antenna blockage with dielectric objects and VRT
- SBR+ PTD/UTD wedge editing improvement
- Memory usage improvement for Distributed Matrix Assembly
- Automatic prediction of the upper multipaction power threshold
- Distributed Sparse Direct Solver: Partial solve without grouping port unknowns
- Layout Component in 3D enhancements (Beta)
- Flex PCB support for Layout component in 3D (Beta)
- Q3D DCR in HFSS 3D (Beta)
- Composite subgroup in network analysis (Beta)
HFSS 3D Layout
- Multizone support for Layout components
- Usability and performance enhancements
- Rigid Flex workflow enhancements
- IC mode enhancements
- Encrypted technology support in IC mode
- SIwave Near Field simulation in 3D Layout (Beta)
- Extensions to EDB CPython API (Beta)
- Q3D in 3D Layout IC mode (Beta)
- RaptorX in 3D Layout IC mode (Beta)
Icepak
- AEDT Icepak import into Workbench
- PCB workflow enhancements
- Cylindrical orthotropic properties
- Post-processing and reporting enhancements
- Slider bar meshing enhancements
- Enhanced expression support
- Solar loading per object
- Official release of improved mesh regions
- ECXML import/export speed enhancements
- Thermal Mesh Fusion (Beta)
- GPU Computing for Solver (Beta)
Maxwell
- Litz twisting effects on DC resistance
- Magnetostriction enhancements
- NVH workflow for inverter-fed electric motors
- Nonlinear resistive sheet for 3D magnetostatic solution
- Shell element for modeling thin conductors
- Support value boundary for magnetostatic DDM solution
- Magnetostriction enhancements to initial stress
- Improve core loss calculations with Hysteresis Core Loss Model
- Enhancements to Maxwell Machine Toolkit with Motor-CAD post processing
- Support for Voltage in Maxwell-Fluent co-simulation for Electric Arc application
- Python API for custom core loss definition
- 2D Motor symmetry meshing enhancements
- Support loss adaptive refinement for eddy current solution (Beta)
- Layout Component in 3D Enhancements (Beta)
- Flex PCB Support for Layout Component in 3D (Beta)
- Expression cache calculations with light weight post processor (Beta)
AEDT Mechanical
- Official release of Transient Thermal
- Enabled AEDT Mechanical import into Workbench
- Layout component with trace mapping in Thermal and Structural (Beta)
- Enhanced Layout component gridcut slider & visualization (Beta)
Q3D Extractor
- Commercial release of distributed memory solver for CG
- Commercial release of transition region solver
- Enhanced multi-face uniform current terminals in DC-R
- MLFMM for improved AC-RL solver performance

Circuit

General Enhancements:
- Custom terminations
- New TDR analysis options
- Support for EMI receiver CISPR25
- Semiconductor characterization tool
- Transient diagnostic tools
- Motor model(s) for power electronics
- Add terminal names for RLGC PSpice sub-circuit
- Enhanced DDR5 support in Nexxim: AMI support for clock-forwarded architectures
- Print all top-level node voltages checkbox on transient/dc analysis menu
- New MIPI C-PHY transmitter component (Beta)
SPISim Enhancements:
- Add optimization mechanism and associated GUI settings to CTLE AMI models
- Enable RX_CLOCK of IBIS 7.1 for DDR5
- Add back-channel interface (BCI) for future TX/RX co-optimization
- Batch mode support for IBIS modeling flow and other usage improvements
FilterSolutions
- Balanced filter export to AEDT
EMIT
- Optimal N-to-1 feature and improvements
- Maintain and access multiple channel-level results
- Enable/disable radios and emitters
- Improved STK-EMIT integration/automation
- MIPI C-PHY Toolkit
Twin Builder
- PSPICE performance improvements
- Battery Wizard enhancements
- HPPC fitting error display in Battery Wizard
- Export State Space Model to Modelica Package
- Using conservative pins to connect thermal LTI-ROMs
- Parametric field history in Static ROM Builder
- LS-OPT/LS-DYNA ROM extraction and export
- Optimization algorithms for parameter calibration
- Improved useability for fusion workflow
- TD Composer workflow improvements
- PyTwin: Enhance 3D data handling with TBROM
Granta
- 44 new Materials Data for Simulation (MDS) records:
- 10 magnet materials
- 1 solder resist material
- 16 polymer grades
- 17 PCB laminates
- Updated record names for Panasonic Megtron 7 and Ventec tec-speed 6.0

 

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tags： ANSYS Electronics Suite

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