Found 1 query results that match PakSi-TM

  • Fluent PakSi-TM 1.4.7

    The trend toward smaller device geometries has increased IC functionality and speed. With smaller dies, heat dissipation and the thermal characteristics of the package play a significant role in chip reliability. More and more the critical factor in determining IC reliability is not the IC itself bu.....
    Language : english Authorization: Pre Release Freshtime：2007-08-26 Size: 11MB