Tessent combines features of deterministic scan testing, embedded pattern compression, built-in self test, specialized embedded memory test and repair, and boundary scan, as well as board and system-level test technologies. Comprehensive Solution The Tessent product suite provides comprehensive silicon test and yield analysis solutions that address the challenges of manufacturing test, debug, and yield ramp for today’s SoCs. Built on the foundation of the best-in-class solutions for each test discipline, Tessent brings them together in a powerful test flow that ensures total chip coverage. Tessent™ Memory Test solutions provide the industry’s most advanced memory self-test and repair capabilities. Key features include comprehensive test and diagnostic capabilities to address the quality requirements of new process nodes and memory designs as well as comprehensive repair analysis and self-repair capabilities. Tessent memory test solutions also provide advanced design automation to ensure that all necessary embedded test and repair capabilities can be integrated quickly and efficiently into the design. This is key as the number of memories continues to grow. Tessent memory test solutions support ICs of any size or complexity, reducing IC engineering development effort and improving time-to-market.