HyperLynx Thermal 9.0 Win:
This board-level thermal analysis tool outputs board temperature and gradient maps, component and junction temperatures—plus the amount by which those temperatures exceed their respective limits. This software models electronic boards with up to 3,000 components on each side considering conduction, convection, and radiation. HyperLynx Thermal is used routinely in various industrial applications, including Aerospace, Computer, Networking, Telecom, Industrial Control, Instrumentation, and Automotive electronics.

• Models double-sided multi-layered
  boards with up to 3,000 components per side
• Interfaces to the leading ECAD placement packages for easy file transfer
• Improves reliability predictions with precise calculation of junction temperatures
• Provides impressive color maps that make outstanding reports
• Supports all major global electronic industries
• Allows for intuitive and ease of use
  with Windows-based software

Key Benefits

• Accurate and Fast Analysis
  Our users, experimental wind tunnel tests, and infrared image tests consistently validate an accuracy of +/-10%. The analysis fully performs 3-Dimensional modeling of the complex flow and thermal fields based on heat conduction, convection, and radiation. Finite difference schemes with self-adaptive locally refined meshes are used in the computation to produce extremely fast, yet accurate results. The analysis needs only 1/50 of the time of equivalent finite element programs. Typically, an analysis takes 12 seconds for a board of 100 components run on a 100 MHz Pentium PC.
• Easy To Use
  Automatic interfaces with Expedition, PADS, Board Station, Allegro, CADSTAR, OrCAD, P-CAD, Protel, Visula, and other placement packages are available. Outputs colorful temperature and gradient maps that are easy to read and enhance reports.
• Advanced Features
  HyperLynx Thermal 9.0 can evaluate boards with multiple layers and irregular shapes. The board can be placed at the edge or interior of a cabinet, anchored by screws to heat sinks, cooled through wedge locks at the edges, in a sealed compartment, or in an open system with forced convection. The flow field can be natural or forced convection, and closed systems can be cooled by heat exchangers. Effects of gravity, air pressures, and flow directions are modeled. Heat sinks, heat pipes, chip fans, and conduction pads can be attached to components.