Sigrity SpeedXp Suite 8.0

Description

With SpeedXP 8.0, Sigrity is introducing user-customizable workflows to enhance productivity for both new and experienced users.  Sigrity is providing seven default workflows for use with PowerSI and SPEED2000 covering topics such as a model extraction workflow, power ground noise simulation workflow and EMC/EMI simulation workflow.  Sigrity provided workflows can be tuned to adapt to individual / team preferences and users can also easily create their own workflows.
 

ENHANCEMENT SUMMARY

Here is a quick feature summary.   Software releases are available for electronic download at Sigrity's Customer Sign-In area. 
Primary user contacts have account user name and password information.   Password retrieval is available at the SPDnet site.

SpeedXP (8.0 Production Release)

Overall SpeedXP capability:
 

  • Customizable workflows ... for user defined and Sigrity provided out-of-the box workflows to streamline user activity
  • Model Connection Protocol (MCP) ... Sigrity-developed open format that is useful to easily connect chip, package and board models
  • Material library for metals and dielectrics ... for efficient handling of temperature dependent material effects
  • Unified circuit manager ... for dockable viewing panes with typical functions and views, consistent across products
  • Usability options ... Tip of the Day, layout editing, via shape handling, zoom control, image export

 

SPEED2000 users will see:
 

  • SPEED2000 provided workflows ... for SSO simulation, Power/Ground noise simulation, EMC/EMI simulation, device model simulation
  • Waveform analysis functions ... eye diagram extensions, waveform linking and measurement enhancements
  • Trace voltage visualization ... signal waveform propagation through a net with 3D animation

 

PowerSI users will see:
 

  • PowerSI provided workflows ... for model extraction, hot spot (resonance detection), EMC/EMI simulation
  • Broadband Network Parameter (BNP) viewer ... for visualization and post processing of extracted data (link to viewer)
  • Compressed S-parameter output ... produces file sizes 100x smaller than zipped TouchStone files

 

PowerDC users will see:
 

  • Multi-board analysis ... streamlines broader system IR drop assessment and DC sign-off
  • SPICE model support ... to import and generate SPICE models with a wizard that includes MCP header information
  • Usability options ... plane current density vector display, constraint management simplification

 

Broadband SPICE users will see:
 

  • Enhanced accuracy ... improved impedance fitting for DC at open ports
  • Flow support ... automatic launch from within PowerSI

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