Sigrity, Inc. today announced SpeedPKG Suite, a suite of analysis tools customized for IC package applications and designed to enable fast, easy, accurate and complete electrical characterization. In addition, the company announced availability of the first of many SpeedPKG modules, XtractIM, which helps IC package design teams assess package electrical performance issues much faster than previously possible.

Rather than using static and quasi-static solvers to extract package RLGC parameters, XtractIM extracts package models from S parameters computed by full-wave field solvers, fully taking into account various electromagnetic interactions. Unlike tools that have to use symmetric circuit structures to represent non-symmetric physical structures, XtractIM correctly represents the non-symmetric nature of the physical structures by generating non-symmetric Pi and T type Spice models according to system network (S, Z or Y) parameters; this approach results in more accurate model response in a broader frequency range, without increasing the size of the Spice model. With Sigrity’s proprietary hybrid electromagnetic solutions, XtractIM requires only hours or minutes to run.

With its specialized workflow that makes the tool easy to use and deploy, XtractIM is ideal for package design team engineers involved in modeling and characterization who need to provide IBIS (I/O Buffer Information Specification) models or Spice circuit netlists to their customers and/or other internal groups such as IC groups or reference board design groups. It also benefits SI engineers who need to develop solid package design guidelines, and package layout engineers in package design teams who must follow design guidelines and perform design rule checking.

Named for the extraction of IBIS and Spice circuit models of IC packages, XtractIM extracts the most common electrical models of IC packages according to IBIS, which is used to assess the electrical performance of IC packages. It can also export Spice netlists of electrical models for system-level analysis including drivers, receivers and interconnects. It generates the IBIS package RLC matrix model with coupling between signal, power and ground nets, as well as the Spice-equivalent circuits of package RLGC models of different topologies (Pi or T circuit topology), including coupling between signal, power and ground nets. Customized reports and displays minimize user setup time and the efforts required to obtain desired results.

The XtractIM solution is designed to handle both flip-chip packages and wirebond packages of 3D wirebond profiles, and can extract models of a full package or selected nets of a package. XtractIM also can interface with data files in various formats, including upd, mcm, na2, dsn, spd. Unlike other package model extraction tools that only can handle bare packages, XtractIM is the only solution in which the complete physical structure and all the lumped components mounted on the package can be included in the extraction of package models. Inclusion of on-package decoupling capacitors is critical to obtain correct modeling of package power and ground systems, as well as the coupling among signal, power and ground nets.