Core Functionality

• New product: COMSOL Compiler™
• More than one Parameter node in the Model Builder
• Group Model Builder nodes into folders
• Coloring of models based on selections
• Faster solution time in the Windows^® operating system

Electromagnetics

• Fully parametric and ready-to-use parts for coils and magnetic cores
• Electric currents and Joule heating in thin, layered structures
• More than 40 new substrate materials for printed RF, microwave, and millimeter-wave circuits
• New boundary conditions for thin metallic layers and antireflective coatings
• Schrödinger-Poisson Equation interface for semiconductor simulations
• New and updated Part Library for ray optics
• More powerful STOP analysis
• Optical dispersion models for ray optics

Structural Mechanics and Acoustics

• New product: Composite Materials Module
• Shock response spectrum analysis
• Material activation for additive manufacturing
• Microstructure modeling based on unit cells
• Axisymmetric shells
• Soft connectors
• FSI for shells, membranes, structural assemblies, and multibody dynamics
• Mullins effect for rubber
• Damage models for brittle materials such as concrete
• Acoustic ports
• Nonlinear acoustic Westervelt computations

Fluid Flow and Heat Transfer

• Large eddy simulation (LES)
• FSI for multiphase flow
• New phase transport models for free and porous media flow
• Multiphase flow in porous media
• Updated Euler-Euler, Level-Set, and Mixture Model formulations
• New non-Newtonian fluid models
• Heat radiation with diffuse-specular reflections and semitransparent surfaces
• Surface-to-surface radiation with arbitrary number of spectral bands
• Light diffusion equation
• Heat transfer in thin, layered structures

Chemical

• Updated Thermodynamics interface
• Equilibrium reactions in Maxwell-Stefan diffusion
• The Reacting Flow multiphysics coupling is now available for the Transport of Diluted Species interface
• Lumped models for batteries
• Boundary conditions for membranes, such as for electrodialysis