New Product: Composite Materials Module

The new Composite Materials Module enables modeling of composite laminates by providing a range of pre- and postprocessing tools for structures with tens or hundreds of layers. By combining the Composite Materials Module with new functionality for layered shells, available in the Heat Transfer Module and the AC/DC Module, users can perform multiphysics analysis in composite materials, such as Joule heating in combination with thermal expansion.

Core Functionality Summary

The core functionality improvements of the COMSOL Multiphysics® software includes several features to better organize your model. You have the capability of organizing parameter sets in a model using multiple parameter nodes, as well as the capability of performing parametric sweeps over multiple parameter sets. Furthermore, you can organize most any Model Builder nodes into groups and assign custom coloring schemes to geometry models based on selections. Among the various performance improvements is a new memory allocation scheme resulting in computations that are several times faster in the Windows® operating system for computers with newer processors having more than 8 processor cores.


Electromagnetics Summary

For electromagnetics modeling, the AC/DC Module features a new Part Library with fully parametric and ready-to-use coils and magnetic cores. Similarly, the RF Module enhances the RF material library with new substrate materials for modeling printed RF, microwave, and millimeter-wave circuits. The Ray Optics Module features improved modeling tools for structural-thermal-optical performance (STOP) analysis. Finally, the Semiconductor Module brings a new Schrödinger-Poisson Equation multiphysics interface to connect with the Electrostatics interface






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