DYNAFORM 5.8 Released with Improved Functionality Version Offers a Simplified INC Solver December 14, 2010—Engineering Technology Associates, Inc. (ETA) announces the release of DYNAFORM Version 5.8. DYNAFORM is a simulation software solution which analyzes the entire die system and allows organizations to bypass soft tooling, reducing tryout time, lowering costs, and improving cycle times and productivity. This latest release offers many new and improved features, as well as enhanced Pre- and Post-Processing capabilities for a more streamlined and robust user experience. Possibly the most notable addition in this version is the availability of a new explicit incremental INC Solver to support rapid die face design and analysis of formability concerns. The INC Solver offers a value solution for customers who are looking for an easy-to-master virtual tryout tool that generates quick results without sacrificing accuracy. Among the many capabilities added within DYNAFORM’s Blank Size Engineering (BSE) module is a new “BSE Preparation” toolset, providing a host of geometry and mesh tools, as well as a new “Auto Tipping” function. Additions to the DFE module include a “Functional Tool Preparation” command to integrate line, surface, element and node functions with model check and repair functions. “Trim Check” and “Curve Editor” functionalities were also added. DYNAFORM’s powerful Formability Simulation (FS) module was also enhanced in this latest round of development. Some prominent additions include “Tube Bending”, “Roller Hemming”, “Blank Generator” and “Tool Preparation” applications.